Read e-book online Advanced Wirebond Interconnection Technology PDF

By Shankara K. Prasad

ISBN-10: 1402077629

ISBN-13: 9781402077623

ISBN-10: 1402077637

ISBN-13: 9781402077630

"Advanced Wirebond Interconnection know-how addresses twine bonding from either production and reliability views. It analyzes and explores some of the elements that one must think of: layout, fabrics, processing, apparatus, caliber checking out and reliability engineering, and final yet no longer least, operator education. This publication is meant to be a complete resource of data and data that permits either a newcomer to the sector and a veteran who wishes fast details to determine on a approach challenge. The booklet explains not just tips on how to do issues similar to designating a bond pad or a lead finger, find out how to pick out a correct bond twine, the best way to layout a capillary and the way to optimize a bonding method at the manufacturing unit ground, however the ebook additionally explains why to do it that manner. A CD-ROM is incorporated, which includes 2nd and 3D animations of many suggestions which are mentioned during this e-book. The animations with voice-overs aid the reader snatch the tips swifter with visible event, which results in larger retention.

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We will also explore the new copper wire bonding technology that is gaining relevance and importance in the IC assembly industry in the past few years. Issues related to materials, equipment and reliability of copper wire bonds and the current industry trends in each of these domains will be discussed. 2 Materials for Wire Bonding Bonding wire – An overview Bonding wire used for microelectronic interconnection bonding is a precision metallurgical product developed for the semiconductor manufacturing industry.

24 shows an example of a design of Au wire having both interstitial impurities and a substitutional impurity. To design the Au wire for an application such as, a low loop CSP, or a long loop BGA or for a stacked chip package with staggered bond pads, understanding the mechanical and electrical effects of interstitial impurities like Be or substitutional impurities like Ca, or a noble metal like Pd, is crucial.

For example, if a high current device is used in space applications, then the bond wire required is Al and the package Materials for Wire Bonding 19 used must be a ceramic hermetic package. From this example, we can see that the wire must have high current carrying capability, must with- stand power cycling, must with stand temperature cycling, and must have long term corrosion resistance. On the contrary, an inexpensive Chip-on-Board IC device used in a singing Christmas card, needs bond wires that can be bonded at high speed to reduce manufacturing cost but with minimum reliability requirements.

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Advanced Wirebond Interconnection Technology by Shankara K. Prasad


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